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| Product Brief BP2 Entry & Basic Platform Infineon's cost-optimised GSM/GPRS platform BP2 is one of the highest integrated and most complete system solutions available today. It allows customers to develop and market mobile phones in record time. Included are all components needed to build a mobile phone: baseband, RF, power management and cellular RAM ICs, complemented by state of the art protocol stack, the APOXI TM application framework and a fully customizable Man-Machine-Interface (MMI) Infineon's development environment offers development boards, a comprehensive tool chain and a SDK for the application framework. Customers will also benefit from Infineon's extensive experience with chipsets and complete customized solutions in the mobile market. The BP2 fulfills all requirements to meet the handset success factors in the entry and basic phone segment: lowest-cost electronic bill-of-material, smallest PCB size area and a hardware independent application and MMI development platform. Therefore handset manufacturers can completely concentrate on handset differentiation factors like design, product variants, MMI styles etc. www.infineon.com/mobilesolutions Mobile Solutions Never stop thinking. Product Brief BP2 Modem Functions Standards GSM/GPRS Dualband Triband & Quadband options RF Band: 850/900/1800/1900 MHz Protocol stack GSM/GPRS Rel. 97 Voice Features Telephony Vocoders: HR, FR, EFR, AMR Echo cancellation Noise suppression Data Features GPRS class B, multi-slot class 10, coding scheme CS 1..4 CSD 9.6 kbit/s SMS MO/MT, cell broadcast AT command set Fax class 2 STK class 3 Supported Applications Common SW Feature Set WAP 2.0 EMS Rel. 5 MMS Rel. 1.1 Java MIDP 1.0 Integrated polyringer 32 voices @ 16 kHz Predictive text input Voice dialling & command Optional Hardware Features IrDA 115 kbit/s Stereo FM radio Polyphone ringer more than 40 voices Integrated camera System Architecture of BP2 Key Components Baseband E-GOLDlite Power management E-Powerlite RF transceiver SMARTi SD 16 - 32 Mbit Cellular RAM Predefined Component Hardware Option Customer Specific Infineon Component 1 4 7 * Handsfree, 8 /400 mW 32 Polyphone Ringer Earpiece and Poly-Ringer E-Powerlite Analog I2C 6x4 E-GOLDlite C C166 @ 52 MHz TEAKlite @ 104 MHz IQ/RF Control Battery Li-Ion, Li-Pol, NiMH PA SMARTi SD FEM V24/IrDA Modulated IrDA Driver and Diodes IrDA Option I2C, SSC Flash Cellular RAM RTC Back-up Connectors Data + Address Bus Polyphone Ringer > 32 Voices Display/ Camera Controller Vibrator Charge Backlight 2 5 8 0 3 6 9 # Standard or Secondary Display B&W or Color SIM Card Direct SIM Interface Up to VGA Highest Integrated GSM/GPRS Platform Leading low-cost GSM/GPRS platform for basic & entry level terminals 140 components (without customer specific parts) Leading edge eBOM CMOS RF transceiver Comprehensive feature set built-in Smallest system PCB size Modem 10 cm 2 Flip-chip baseband, 8 x 8 mm A P O X I TM A p p l i c a t i o n F r a m e w o r k The APOXI TM Application Framework enables and includes A platform independent, easily reusable environment for rapid development and cost efficient solutions A powerful reference MMI with a broad range of pre-integrated reference applications An open API to enable unlimited 3rd party applications APIs for SIM, NVRAM, Flash, Display, Audio, Video, Real Time Operating Systems and the TCP/UDP family An object-oriented framework, ideal for developing customized "Look & Feel" MMIs & applications Support for Java, camera, and a broad range of advanced multimedia codecs An innovative roadmap of advanced applications provided by a leading developer network How to reach us: http://www.infineon.com Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81669 Munchen (c) Infineon Technologies AG 2004. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Template: pb_tmplt.fm/4/2004-01-01 Published by Infineon Technologies AG Ordering No. B134-H8365-X-0-7600 Printed in Germany PS 0104.8 NB |
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